Meiichi Ohta
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Oct 2, 1991 → Oct 2, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6156427A | Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.