Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition
US6156427A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1991 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Oct 2, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electromagnetic wave interference shield structure molded from an electroconductive resin composition for molding, which comprises columnar pellets of a specific length, made of a bundle of iron-based metal fibers as an essential component and at least one bundle of at least another kind of electroconductive fibers of different material in a different diameter than that of the iron-based metal fibers as independent electroconductive fiber-cores, coated with a thermoplastic resin having a specific range of heat distortion temperature continuously in the longitudinal direction has a stable and distinguished shield effect for a prolonged time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.