Michael Chapman
2Patents
2h-index
3Co-inventors
27Inventor score
Filing activity: Sep 12, 2003 → Sep 25, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030469B2 | Method of forming a semiconductor package and structure thereof | Electricity | 274 | Expired |
| US7012324B2 | Lead frame with flag support structure | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.