Lead frame with flag support structure
US7012324B2 · kind B2 · utility
8Cited by
24References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Mar 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.