Michael G. Finley
10Patents
9h-index
2Co-inventors
54Inventor score
Filing activity: Jun 23, 1994 → Aug 23, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5675180A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 135 | Expired |
| US5661087A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 71 | Expired |
| US5698895A | Silicon segment programming method and apparatus | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5657206A | Conductive epoxy flip-chip package and method | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6134118A | Conductive epoxy flip-chip package and method | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5837566A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5936302A | Speaker diaphragm | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6486528B1 | Silicon segment programming apparatus and three terminal fuse configuration | Electricity | 14 | Expired |
| US5994170A | Silicon segment programming method | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6188126A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.