Michael Gerald Boyle
2Patents
1h-index
9Co-inventors
37Inventor score
Filing activity: Oct 1, 2009 → Jan 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8986789B2 | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces | Emerging Cross-Sectional Technologies | 1 | Active |
| US11328744B1 | On-wafer integrated laser for heat-assisted magnetic recording | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.