On-wafer integrated laser for heat-assisted magnetic recording
US11328744B1 · kind B1 · utility
0Cited by
9References
20Claims
0Family size
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Key dates
| Filing date | Jan 29, 2021 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus comprises a substrate. A laser is deposited above the substrate. The laser includes one or more non-self-supporting layers of crystalline material. A metallic adhesive is disposed between the laser and the substrate. The metallic adhesive is configured to adhere the laser to the substrate. A waveguide is deposited proximate the laser. The waveguide is configured to receive light from the laser and direct the light to a recording medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.