Michael Lemmer
2Patents
1h-index
13Co-inventors
45Inventor score
Filing activity: Mar 4, 1996 → Dec 5, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5793637A | Method and apparatus for banding copper cathodes | Performing Operations; Transporting | 3 | Expired |
| US11440310B2 | Method for producing a substrate adapter and substrate adapter for connecting to an electronic component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.