Patent · US Active

Method for producing a substrate adapter and substrate adapter for connecting to an electronic component

US11440310B2 · kind B2 · utility

0Cited by

4References

12Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Andreas Klein · Bonn, DE
Andreas Hinrich · Alzenau, DE
Michael Schaefer · Heidenau, DE
Yvonne Loewer · Hanau, DE
Wolfgang Schmitt · Rodgau, DE
Michael Lemmer · Amarillo, US

Key dates

Filing date	Dec 5, 2019
Grant date	Sep 13, 2022
Priority date	—
Expiry date	Dec 21, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15747
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.