Michael Tucker
3Patents
2h-index
12Co-inventors
37Inventor score
Filing activity: Feb 28, 2001 → Nov 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6663674B2 | Method of handling a silicon wafer | Electricity | 2 | Expired |
| US6362098B1 | Plasma-enhanced chemical vapor deposition (CVD) method to fill a trench in a semiconductor substrate | Electricity | 2 | Expired |
| US8397207B2 | Logical structure design surface | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.