Michael Vadnais
3Patents
1h-index
17Co-inventors
45Inventor score
Filing activity: Jun 28, 2000 → Jul 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6603195B1 | Planarized plastic package modules for integrated circuits | Electricity | 8 | Expired |
| US12037943B2 | Waste heat recovery system | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US12259194B2 | Thermal management system | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.