Planarized plastic package modules for integrated circuits

US6603195B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David V. Caletka · Apalachin, US
• James L. Carper · Colchester, US
• John P. Cincotta · South Burlington, US
• Kibby B. Horsford · Saint Johnsbury Center, US
• Gary H. Irish · Jericho, US
• John J. Lajza, Jr. · South Burlington, US
• Gordon C. Osborne, Jr. · South Burlington, US
• Charles R. Ramsey · South Burlington, US
• Robert M. Smith · معلمی نژاد, US
• Michael Vadnais · Milwaukee, US

Key dates

• Filing date: Jun 28, 2000
• Grant date: Aug 5, 2003
• Expiry date: Jun 28, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.