Midori Imura
2Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Oct 10, 1985 → Jan 6, 1987
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4659587A | Electroless plating process and process for producing multilayer wiring board | Electricity | 38 | Expired |
| US4766009A | Selective working method | Electricity | 24 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.