Selective working method
US4766009A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1987 |
| Grant date | Aug 23, 1988 |
| Priority date | — |
| Expiry date | Jan 6, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A selective working method in which the surface to be worked of a workpiece is locally irradiated with energy beams and an electroless plating solution or an electroless etching solution is contacted with the irradiated workpiece surface, with the electroless plating solution or the electroless etching solution flowing continuously in the substantially same direction of as the direction of an irradiation of energy beams. The electroless plating of the electroless etching can be conducted selectively by this method. Above selective working method is best suited for the formation or correction (repair, filling up etc.) of micro-patterns on the workpiece such as metals, semi-conductors, insulators, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.