Mike Brenner
2Patents
2h-index
5Co-inventors
27Inventor score
Filing activity: May 8, 1997 → May 4, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6063696A | Method of reducing wafer particles after partial saw using a superhard protective coating | Electricity | 34 | Expired |
| US5817569A | Method of reducing wafer particles after partial saw | Electricity | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.