Mimi Munson Tantillo
3Patents
1h-index
4Co-inventors
33Inventor score
Filing activity: Feb 6, 2004 → Feb 5, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7645940B2 | Substrate with via and pad structures | Emerging Cross-Sectional Technologies | 26 | Expired |
| US9089063B2 | Method of reducing solder wicking on a substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US8378222B2 | Method of reducing solder wicking on a substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.