Min Wang
4Patents
2h-index
7Co-inventors
37Inventor score
Filing activity: Jun 24, 2004 → Jun 28, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7229502B2 | Method of forming a silicon nitride layer | Electricity | 266 | Expired |
| US9386690B2 | First and second differential interconnects having interleaved stub traces | Emerging Cross-Sectional Technologies | 4 | Active |
| US9936570B2 | Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate | Electricity | 1 | Active |
| US10076024B2 | Differential interconnect with first and second transmission traces having a bend and including stub traces connected to the transmission traces | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.