Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate
US9936570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2014 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Dec 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect topology is disclosed that includes a plurality of interconnections, each of which is coupled together using a via, where at least two of the vias are staggered with respect to each other. In one embodiment, the interconnect topology comprises a substrate, multiple signal traces routed through the substrate on multiple layers, and a plurality of vias, where each via couples a pair of the signal traces to form an interconnection between different ones of the multiple layers, and where a pair of vias comprise a first via to carry a positive differential signal via and a second via to carry a negative differential signal that are coupled to signal traces to form a differential signal pair. The differential first and second vias are staggered with respect to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.