Ming Chan
2Patents
2h-index
7Co-inventors
33Inventor score
Filing activity: Feb 28, 2002 → Sep 14, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7080444B1 | Apparatus for forming an electronic assembly | Emerging Cross-Sectional Technologies | 71 | Expired |
| US7576656B2 | Apparatuses and methods for high speed bonding | Electricity | 51 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.