Apparatuses and methods for high speed bonding
US7576656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Jun 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.