Ming Son
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: May 10, 2002 → May 10, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6852607B2 | Wafer level package having a side package | Electricity | 36 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.