Miso Shin
4Patents
1h-index
8Co-inventors
30Inventor score
Filing activity: Mar 15, 2018 → Jan 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10916554B2 | Three-dimensional semiconductor memory device | Electricity | 1 | Active |
| US11257708B2 | Gap-fill layers, methods of forming the same, and semiconductor devices manufactured by the methods of forming the same | Electricity | 0 | Active |
| US11640922B2 | Gap-fill layers, methods of forming the same, and semiconductor devices manufactured by the methods of forming the same | Electricity | 0 | Active |
| US10566338B2 | Three-dimensional semiconductor memory device and method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.