Mitsuru Oota
3Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Feb 10, 2006 → May 22, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7844377B2 | In-vehicle communication system, on-board terminal, portable device, and in-vehicle communication method | Physics | 21 | Active |
| US7256485B2 | Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7331737B2 | Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.