Na-ein Lee
3Patents
2h-index
11Co-inventors
34Inventor score
Filing activity: Nov 17, 2016 → Dec 18, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10639875B2 | Wafer bonding apparatus and wafer bonding system including the same | Electricity | 5 | Active |
| US9812353B2 | Semiconductor device and method of manufacturing the same | Electricity | 2 | Active |
| US9984921B2 | Semiconductor device and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.