Nancy C. Eickman
7Patents
7h-index
7Co-inventors
45Inventor score
Filing activity: Feb 7, 1983 → Dec 5, 1986
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4483727A | High modulus polyethylene fiber bundles as reinforcement for brittle matrices | Emerging Cross-Sectional Technologies | 52 | Expired |
| US4458039A | Thermotropic liquid crystalline polymer blend with reduced surface abrasion | Chemistry; Metallurgy | 51 | Expired |
| US4632798A | Encapsulation of electronic components with anisotropic thermoplastic polymers | Emerging Cross-Sectional Technologies | 45 | Expired |
| US4720424A | Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating | Emerging Cross-Sectional Technologies | 33 | Expired |
| US4524101A | High modulus polyethylene fiber bundles as reinforcement for brittle matrices | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4732921A | Flame retardant polybutylene terephthalate | Chemistry; Metallurgy | 16 | Expired |
| US4719250A | Encapsulation of electronic components | Electricity | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.