Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating
US4720424A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1986 |
| Grant date | Jan 19, 1988 |
| Priority date | — |
| Expiry date | Jun 9, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembl…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.