Nayeemuddin Mohammed
3Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Nov 5, 2014 → Jun 24, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9304283B2 | Bond-pad integration scheme for improved moisture barrier and electrical contact | Physics | 2 | Active |
| US9405089B2 | High-temperature isotropic plasma etching process to prevent electrical shorts | Physics | 0 | Active |
| US9939710B2 | High-temperature isotropic plasma etching process to prevent electrical shorts | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.