Nick Zenner
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Mar 27, 2015 → Mar 27, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10518517B2 | Methods and apparatus for lamination of rigid substrates by sequential application of vacuum and mechanical force | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.