Methods and apparatus for lamination of rigid substrates by sequential application of vacuum and mechanical force
US10518517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2535/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and apparatus for lamination of substrates, e.g. rigid plastic layers, to manufacture laminated products. The methods include the sequential application of vacuum and mechanical force through a two-stroke process performed by a lamination apparatus having one or more force-producing stroke cylinders. Actuation of a cylinder to produce a first stroke creates a sealed chamber within the apparatus, enclosing a stack of substrates to be laminated. The sealed chamber may be evacuated of air by application of a vacuum. Subsequent actuation of a cylinder to produce a second stroke applies mechanical force to the sealed chamber, which compresses the substrates into a laminated product substantially free of air bubbles or voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.