Patent · US Active

Methods and apparatus for lamination of rigid substrates by sequential application of vacuum and mechanical force

US10518517B2 · kind B2 · utility

0Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 27, 2015
Grant dateDec 31, 2019
Priority date
Expiry dateFeb 24, 2036

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2535/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Method and apparatus for lamination of substrates, e.g. rigid plastic layers, to manufacture laminated products. The methods include the sequential application of vacuum and mechanical force through a two-stroke process performed by a lamination apparatus having one or more force-producing stroke cylinders. Actuation of a cylinder to produce a first stroke creates a sealed chamber within the apparatus, enclosing a stack of substrates to be laminated. The sealed chamber may be evacuated of air by application of a vacuum. Subsequent actuation of a cylinder to produce a second stroke applies mechanical force to the sealed chamber, which compresses the substrates into a laminated product substantially free of air bubbles or voids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.