Oliver Mieth
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Feb 20, 2014 → Feb 20, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9257329B2 | Methods for fabricating integrated circuits including densifying interlevel dielectric layers | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.