Pascale Gouker
2Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Nov 5, 2015 → Nov 5, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9812429B2 | Interconnect structures for assembly of multi-layer semiconductor devices | Electricity | 12 | Active |
| US9881904B2 | Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.