Patrick Guay
5Patents
3h-index
13Co-inventors
46Inventor score
Filing activity: Aug 29, 2000 → Apr 25, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6746894B2 | Ball grid array interposer, packages and methods | Electricity | 200 | Expired |
| US7274095B2 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Electricity | 6 | Expired |
| US6617201B2 | U-shape tape for BOC FBGA package to improve moldability | Electricity | 5 | Expired |
| US7528007B2 | Methods for assembling semiconductor devices and interposers | Electricity | 3 | Active |
| US6486536B1 | U-shape tape for BOC FBGA package to improve moldability | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.