U-shape tape for BOC FBGA package to improve moldability
US6617201B2 · kind B2 · utility
5Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.