Paul Bell
6Patents
4h-index
14Co-inventors
54Inventor score
Filing activity: Sep 24, 1998 → Sep 15, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6429675B2 | Structure and method for probing wiring bond pads | Electricity | 19 | Expired |
| US6373143B1 | Integrated circuit having wirebond pads suitable for probing | Electricity | 15 | Expired |
| US8536526B2 | Methods of operating a nanoprober to electrically probe a device structure of an integrated circuit | Electricity | 10 | Active |
| US7775535B2 | Suspension subassembly | Performing Operations; Transporting | 9 | Active |
| US6294028A | Mercury process gold ballbond removal apparatus | Emerging Cross-Sectional Technologies | 2 | Expired |
| US11880718B2 | System and method for generating secure partition regions in open and secure processor environments | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.