Paul Mescher
8Patents
3h-index
4Co-inventors
50Inventor score
Filing activity: May 3, 1995 → Jan 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6130476A | Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion | Electricity | 55 | Expired |
| US6162660A | Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package | Electricity | 19 | Expired |
| US9892990B1 | Semiconductor package lid thermal interface material standoffs | Electricity | 14 | Active |
| US10109591B1 | Integrated shield package and method | Electricity | 3 | Active |
| US6821814B2 | Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package | Electricity | 2 | Expired |
| US6294828A | Semiconductor chip package | Electricity | 1 | Expired |
| US10886235B2 | Integrated shield package and method | Electricity | 0 | Active |
| US11848275B2 | Integrated shield package and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.