Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package
US6821814B2 · kind B2 · utility
2Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2000 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | May 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of an organic chip carrier substrate, as well as the resulting chip package, are disclosed. The inventive method does not require the use of a solder mask, does not require the melting of the bulk of any of the solder balls and does not require the use of a fluxing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.