Inventor · Salem, OR, US

Paul Rubens

7Patents
4h-index
11Co-inventors
54Inventor score

Filing activity: Oct 9, 1996 → Jan 19, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US5825625A Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink Electricity 47 Expired
US5960535A Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Emerging Cross-Sectional Technologies 23 Expired
US6018193A Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink Emerging Cross-Sectional Technologies 10 Expired
US10461467B2 Compact card edge connector Electricity 5 Active
US8475246B2 Airflow damper that accommodates a device Electricity 4 Active
US8979558B2 Interposer assembly Electricity 4 Active
US11189946B2 Compact combination connector Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.