Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US5825625A · kind A · utility
47Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Oct 9, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.