Pete Hudson
4Patents
3h-index
7Co-inventors
39Inventor score
Filing activity: Jan 7, 1998 → Aug 30, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6007669A | Layer to layer interconnect | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6757968B2 | Chip scale packaging on CTE matched printed wiring boards | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6109369A | Chip scale package | Electricity | 4 | Expired |
| US6560108B2 | Chip scale packaging on CTE matched printed wiring boards | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.