Peter D. Van Dyke
3Patents
1h-index
6Co-inventors
37Inventor score
Filing activity: Sep 20, 2001 → Apr 4, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6657130B2 | Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages | Emerging Cross-Sectional Technologies | 41 | Expired |
| US9600247B2 | Extensible definition of interactive system productivity facility (ISPF) panels | Physics | 1 | Active |
| US8825905B2 | Mainframe web client | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.