Phil Wu
2Patents
1h-index
7Co-inventors
27Inventor score
Filing activity: Nov 14, 2014 → Jun 26, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10269852B2 | Vertically integrated three-dimensional CMOS image sensors (3D CIS) bonded with control circuit substrate | Electricity | 3 | Active |
| US9362332B1 | Method for semiconductor selective etching and BSI image sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.