Ping-Feng Lee
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Feb 17, 2006 → Feb 17, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7427807B2 | Chip heat dissipation structure and manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.