Chip heat dissipation structure and manufacturing method
US7427807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2006 |
| Grant date | Sep 23, 2008 |
| Priority date | — |
| Expiry date | Jul 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.