Ping Wei CHEN
2Patents
1h-index
7Co-inventors
33Inventor score
Filing activity: Aug 7, 2008 → Jan 3, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9287175B2 | Fabrication method for dicing of semiconductor wafers using laser cutting techniques | Electricity | 3 | Active |
| US8033011B2 | Method for mounting a thinned semiconductor wafer on a carrier substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.