Pingliang Tu
2Patents
0h-index
8Co-inventors
27Inventor score
Filing activity: Dec 27, 2013 → Jan 15, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10861714B2 | Heating of a substrate for epoxy deposition | Electricity | 0 | Active |
| US10399170B2 | Die attachment apparatus and method utilizing activated forming gas | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.