Die attachment apparatus and method utilizing activated forming gas
US10399170B2 · kind B2 · utility
0Cited by
34References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2013 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83815
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.