Pingping Ye
3Patents
0h-index
12Co-inventors
35Inventor score
Filing activity: Oct 28, 2009 → Jun 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11384446B2 | Compositions and methods for the electrodeposition of nanotwinned copper | Performing Operations; Transporting | 0 | Active |
| US11873568B2 | Compositions and methods for the electrodeposition of nanotwinned copper | Performing Operations; Transporting | 0 | Active |
| US9175400B2 | Immersion tin silver plating in electronics manufacture | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.