Compositions and methods for the electrodeposition of nanotwinned copper
US11873568B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jun 7, 2022 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Jun 7, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.