Pirooz Emad
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Aug 21, 1997 → Aug 21, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5798567A | Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors | Emerging Cross-Sectional Technologies | 141 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.