Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
US5798567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1997 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Aug 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array to integrated circuit interconnection. The interconnection includes a ball grid array substrate having a first surface and a second surface. The first surface comprising a plurality of substrate interconnection conductive pads. A power supply via connects a power supply conductive pad of the first surface to a first conductive area on the second surface. A ground via connects a ground conductive pad of the first surface to a second conductive area on the second surface. A decoupling capacitor connected between the first conductive area and the second conductive area. The interconnection further comprises an integrated circuit comprising a plurality of integrated circuit conductive pads. A plurality of smaller solder balls interconnect at least one of the integrated circuit conductive pads to at least one of the substrate interconnection conductive pads. A circuit board substrate is electrically interconnected by larger solder balls to the ball grid array substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.